Objectives

Moore4Power pursues four specific objectives, complemented by sustainability as an intrinsic objective across the entire project. Together, they advance the integration, modularity, reliability, security and sustainability of next-generation power electronics.
Intrinsic Objective InO — Sustainable Power Electronics & Circular Economy
0 Towards sustainable PE and circular economy: DPP framework, LCA and sustainable material pathways
Sustainability is embedded across Moore4Power. The project advances circular power electronics through Digital Product Passports, Life Cycle Assessment and sustainable materials. Design-for-X approaches support repair, reuse, remanufacturing and recycling, while modular architectures and extended product lifetimes help reduce resource consumption and the environmental footprint of future power electronic systems.
Objective O1 — Power Chiplets & Heterogeneous Integration
1 Power Chiplet Enabled Heterogeneous and Functional Integration and Hybrid Bonding for Ultra Efficient, Parallelized PE Systems
Moore4Power brings the chiplet paradigm into power electronics. Power Chiplets, hybrid bonding and advanced packaging enable the integration of different semiconductor technologies, sensors, control and communication functions within compact power systems. Combining technologies such as Si, SiC and GaN enables higher efficiency, increased power density, improved reliability and new levels of functional integration.
Objective O2 — Modular PEBBs for Faster Market Deployment
2 Rapid Market Deployment of HW-SW PEBB-based Modular Systems
Moore4Power accelerates the development of power electronic systems through modular Power Electronics Building Blocks. Standardized interfaces, HW/SW co-design, AI-supported simulation and automated engineering workflows enable parallel development and reuse across applications. The approach reduces development effort and integration complexity while helping innovative power electronic solutions reach industrial applications and the market significantly faster.
Objective O3 — Smart, Reliable & Affordable Power Electronics
3 Smart Functional Integration for Power Electronics – AI-Enabled, Redundancy-Free Reliability for Affordable, High-Quality Systems
Moore4Power combines intelligent monitoring, digital twins, AI-supported design and adaptive control to create more reliable power electronic systems. Health monitoring and Remaining Useful Life prediction enable systems to react to degradation before failures occur. Smart functional integration reduces unnecessary hardware redundancy while improving reliability, maintainability, product lifetime and overall system quality at competitive cost.
Objective O4 — Secure & Explainable Real-Time Intelligence
4 Secure, Explainable and Real-Time Monitoring and Control of Power Electronics Systems
Moore4Power integrates security and trust from the earliest design stages. Secure-by-design architectures combine hardware and software security primitives with explainable and robust AI for real-time monitoring and control. The project develops protected AI models, secure federated learning and modular security concepts to deliver trustworthy power electronics for critical energy, mobility and industrial applications.

Work Packages

WP1: Requirements

Lead: Alstom Rail Sweden
This work package establishes the common technical foundation for Moore4Power. It defines project-wide system requirements and measurable Key Performance Indicators, and translates the needs of the Energy, Mobility and Industry application domains into clear specifications for technologies and demonstrators. This shared framework ensures that developments across the project remain aligned, comparable and verifiable from initial design to final validation.

Key focus areas:
• Definition of system-level requirements and measurable performance targets
• Translation of application needs into technical specifications and design constraints
• Alignment of cross-cutting innovations and demonstrators with common project objectives
• Consideration of performance, modularity, reliability, safety, security and sustainability

WP2: Cross Innovations

Fraunhofer ENAS
This work package develops the enabling methods, technologies and engineering tools behind the next generation of power electronics. It combines hardware-software co-design, modular system architectures, advanced control and secure-by-design approaches with innovations in semiconductor devices, power modules, heterogeneous integration, packaging, interconnection, cooling, sensing and power conversion. Artificial intelligence supports modelling, simulation, monitoring, optimisation and lifetime prediction.

Key focus areas:
• Advanced co-design methods for electrical, thermal, mechanical, magnetic and software domains
• Novel power devices, modules, integration technologies and efficient converter concepts
• Modular and scalable power-electronics building blocks for diverse applications
• AI-supported design, simulation, condition monitoring and reliability assessment
• Improved cost, performance, power density, safety, security and sustainability

WP3: Use Case and Demonstration

Lead: ABB Oy
This work package brings the project innovations together in application-oriented demonstrators across the three Moore4Power domains: Energy, Mobility and Industry. The solutions are integrated into realistic systems to show how advanced power electronics can improve efficiency, flexibility, reliability and intelligence in demanding applications.

The Energy domain covers bidirectional power conversion, multiport energy routing, vehicle-to-grid solutions, industrial charging infrastructure, scalable high-voltage battery systems and efficient power conversion for lighting and renewable energy. The Mobility domain addresses advanced automotive power architectures, aerospace power conversion and high-performance rail systems. The Industry domain demonstrates high-power drives, intelligent and self-aware converter systems, modular inverter supply units and advanced rectifier solutions.

Key focus areas:
• Integration of cross-cutting technologies into complete application systems
• Demonstration in Energy, Mobility and Industry
• Development of modular, efficient and intelligent power-conversion solutions
• Initial verification under application-relevant operating conditions

WP4: Tests and Validations

Lead: Ingeteam Power Technology
This work package verifies the technologies and demonstrators developed in Moore4Power. Validation ranges from virtual testing and simulation to hardware-in-the-loop environments, laboratory experiments and physical demonstrators. Hardware and software results are assessed against the common project requirements, relevant benchmarks and the state of the art.

The evaluation covers technical performance as well as reliability, safety, security, sustainability and readiness for industrial deployment. The results provide transparent evidence of the project's achievements and deliver feedback for further optimisation.

Key focus areas:
• Testing of cross-cutting methods, technologies, tools and demonstrators
• Validation of integrated use cases in realistic and near-real application environments
• Comparison of results with project targets and reference technologies
• Assessment of overall project performance and technical readiness

WP5: Maximize Impact

Lead: Innovation DIS.CO
This work package ensures that Moore4Power results reach the relevant industrial, scientific, political and public communities and create value beyond the project duration. It coordinates communication, dissemination, exploitation, standardisation, sustainability and circular-economy activities across the consortium.

A strong and recognisable project identity supports targeted communication through the website, publications, events, media and professional networks. Exploitation strategies are tailored to the needs of large companies, SMEs and research organisations. Standardisation activities connect project results with relevant technical committees and future standards. Sustainability principles such as repair, reuse, remanufacturing, recycling and lifetime extension are integrated across the project.

Key focus areas:
• Communication and dissemination of project progress and results
• Exploitation pathways for research results, technologies and demonstrators
• Cooperation with European networks, value chains and stakeholder communities
• Contributions to relevant standards and identification of standardisation gaps
• Sustainability, circular design and long-term impact

WP6: Project Management

Lead: Infineon Technologies AG
This work package provides the organisational framework for the successful implementation of Moore4Power. It coordinates the consortium, monitors technical and financial progress, supports effective decision-making and ensures that the project remains aligned with its objectives, schedule and contractual obligations.

Project management also covers quality assurance, risk and innovation management, internal and external communication, legal and administrative coordination, and research data management. Clear governance structures connect the coordinator, work package leaders, application and innovation leaders, and all project partners. This enables transparent collaboration, early identification of challenges and the timely delivery of high-quality results.

Key focus areas:
• Coordination of the consortium and continuous monitoring of project progress
• Management of scope, schedule, resources, reporting and contractual obligations
• Quality assurance and proactive risk management
• Innovation, knowledge and research data management
• Compliance with legal, ethical, security and funding requirements
The project is supported by the Chips Joint Undertaking and its members, including the top-up funding by the national Authorities of Austria, Belgium, Czech Republic, Finland, France, Germany, Greece, Hungary, Italy, Latvia, Netherlands, Romania, Spain, Sweden, and Switzerland, under grant agreement number 101252572. Co-funded by the European Union.