Our Team

Moore4Power brings together a strong European consortium of partners from industry, research and academia. Together, the project team combines expertise across the entire power electronics value chain – from materials, devices and packaging to intelligent systems, applications and validation.

WORK PACKAGE LEADERS

WORK PACKAGE LEADERS

The Moore4Power Work Package Leaders coordinate the project’s main technical and organisational activities. They connect the expertise of the consortium, align contributions across partners and ensure that the individual developments contribute to the overall project objectives.

With their technical expertise and long-term commitment to the project, the WP Leaders play a central role in driving collaboration and turning the Moore4Power vision into concrete results.

The project is supported by the Chips Joint Undertaking and its members, including the top-up funding by the national Authorities of Austria, Belgium, Czech Republic, Finland, France, Germany, Greece, Hungary, Italy, Latvia, Netherlands, Romania, Spain, Sweden, and Switzerland, under grant agreement number 101252572. Co-funded by the European Union.